Packaging Research and Development Engineer
Packaging Research and Development Engineer
This is an entry level position and compensation will be given accordingly.
The Packaging Research and Development Engineer will lead Low Yield Analysis (LYA) Packaging activities focused on process and defect characterization projects with the objective of driving yield improvement across Assembly Test Technology Developments (ATTDs) portfolio.
As an LYA Engineer, you will set priorities for the platform/project, get results across boundaries, ensure an inclusive work environment.
Your main responsibilities include, but are not limited to:
-Work with a team of engineers and engineering technicians to provide platforms with defect and/or process characterization towards identifying key mechanisms that contribute to RC identification.
-Work across team boundaries to achieve strategic objectives and meet program deliverables.
-Understand program milestones and schedules then translate into team objectives and drive execution.
-Interface with a wide variety of internal teams, as well as external suppliers to represent the ATTD Yield organization and drive innovation.
-Project management, package design and/or development and sustaining support for integrated circuit or semiconductor assemblies, as well as various other electronic components and/or completed units.
-Conduct hands-on lab work, define data acquisition strategy and data analysis plan, and recommend corrective actions and/or fixes to internal customers.
-Develop failure analysis innovative techniques and/or approaches to accelerate failure identification and mechanism understanding.
-Provide consultation concerning packaging and/or assembly problems and improvements in the manufacturing process.
-Respond to customers' requests or events as they occur.
Candidate should be capable of working effectively across organizational boundaries to deliver the ATTD Yield department vision and objectives.
Candidate must exhibit the following traits/skills:
-Work with ambiguity and flexibility with respect to job roles and working hours.
-Analytical and problem-solving skills.
-Communication and presentation skills.
-Some domestic and International travel is required (once per Quarter).
You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.
- Candidate must possess a Master's Degree with 6+months of experience or a PhD Degree with 1+ year of experience in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering Electrical Engineering, or Chemistry and Physics or related field.
2+ years of experience in of the following areas:
- Experience in a role that demands both daily tactical consistency and longer-term strategic definition and roadmap execution.
- Team leadership and project management.
- Apply advanced analytical characterization techniques to industry or graduate research projects.
- Experience with at least with one of the following: AFM, XRD, TEM, FTIR, Raman, SEM, EBSD.
1+ years of experience in the following:
- Packaging technology knowledge with focus on substrate packaging.
- Microscopic techniques: in-situ TEM EELS EDS precession microscopy, stress measurements, AFM-IR, fractography.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.