Foveros Advanced Packaging Engineering Manager (JR0255065)
The New Mexico Disaggregated Manufacturing Organization (NM DMO) is growing rapidly as it brings the Foveros HVM (High Volume Manufacturing) to life under a single organization with all segments of the process co-located at a single campus for the first time. As part of this exciting growth opportunity, the Fab 9 Foveros organization is seeking Advanced Packaging Engineering Module Group Leaders to join our team as key contributors to our startup and ramp into HVM for Sort/Test, Die Prep, and Wafer Level Assembly areas.
As a Fab 9 Engineering Module Group Leader you will manage a group of Process Engineers, partnering with the transfer site and will be responsible for the successful startup and ramp for a module within Fab 9. You will be responsible for daily tactical execution and strategic direction, setting priorities for the team, driving results across boundaries, developing employees, and managing performance. You will be responsible for ensuring a safe, inclusive work environment while meeting your area/factory commitments.
Responsibilities will include but are not limited to:
- Partnering with Manufacturing/Production/Integration and other Engineering teams to execute a successful and on-time factory ramp
- Participating in building out the engineering teams to support production ramp
- Managing and leading the technical engineering team to meet all safety, quality, output, cost, and people performance requirements
- Understanding and driving solutions to technical issues impacting equipment ramp and manufacturing output
- Providing technical and tactical direction, driving methodical sustaining, systematic troubleshooting, and continuous process improvement
- Developing skills and expertise of your team, enabling long term growth and development
- Driving effective meetings and decision-making forums ranging from working level to technical task forces
- Using your creativity, education, industry experience to guide your team to resolving leading edge technological challenges
- Identifying areas of waste and prioritizing appropriately to eliminate
- Working closely with other Module Engineering teams to solve integrated process and equipment problems
- Working with other global partner sites to share learnings, maintain Copy Exactly, and drive improvements
- Partnering with the Manufacturing Team (Operations Managers/Shift GLs) and the Production Team (Manufacturing Engineers and Industrial Engineers) to run the factory, develop technician workforce, and ensure availability and utilization goals are met
- Leading the execution of key programs and deliverables on behalf of the area and the factory
The ideal candidate should also exhibit the following behavioral traits:
- A passion and commitment for growing and developing people
- Results-oriented, organized, assertive, resourceful, and independent
- Capable of distilling complex information into clear messages and communicating both upward and downward in the organization
- Willingness to receive and give multiple inputs/directions and prioritize according to factory and organizational needs
- Attention to quality and detail
- Role modeling Intel's cultural attributes: Inclusion, Customer Obsession, One Intel, Truth and Transparency, Quality, and Fearlessness
Relocation assistance provided.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
- Candidate must have a Bachelor's, Master's, or PhD degree in Mechanical, Electrical, Chemical Engineering, Materials Science, Physics, or a related technical field of study.
- 4+ years of experience as an Engineer in a wafer fabrication environment with demonstrated formal leadership.
Preferred qualifications:
- 5+ years experience with semiconductor equipment and processes
- 2+ years experience managing people
- Experience in advanced packaging- Dicing, Thinning, Bonding, Mold, Die Sort experience desired